EPO-TEK® Conductive Silver-Epoxy

General Properties
100% solids, two component silver filled epoxy with a soft, smooth, thixotropic (becoming less viscous when stirred or shaken) consistency designed specifically for chip bonding in microelectronic and optoelectronic applications.
Excellent handling characteristics, extremely long pot life at room temperature for this electrically conductive silver adhesive. High speed epoxy chip bonding systems are suitable for very fast cures, such as fast circuit repairs. Can be screen printed, machine dispersed or stamped and can withstand wire bonding temperatures in the range of 300 – 400°C.