Copper PELCO® FIB Lift-Out Grid TEM Grids

The typical thickness of the copper lift-out grids is 35µm +/-5µm. The Cu FIB lift-out grids also have a thinner ridge on the inside, where the lamellas can be attached and are protected when stored. Available with either one or two wider v-shaped posts or four narrow flat posts with identification number etch through.