Tempfix™ is a non-conductive thermoplastic hot melt adhesive resin, especially formulated for SEM studies. It does not contain solvents and is stable under high vacuum. Its adhesive characteristics appear in the 40-120°C range. Melting starts at 40°C and it becomes a thin fluid at 120°C, displaying a wide viscosity range. It has a very smooth surface and can be used in SEM imaging without interfering background.